GIGABYTE Technology Co. Ltd., a leading manufacturer of motherboards and graphics cards is proud to showcase latest range of high performance, low working temperature motherboards featuring GIGABYTE's proprietary Ultra Durable 3 Technologies, including a sneak peek of the first AMD platform DDR3 solution, the GA-MA790FXT-UD5P with support for the new AM3 processors, as well as demonstrations of the latest Intel Core i7 platform motherboards based on Intel's X58 chipset.

GIGABYTE is again excited to participate in CeBIT 2009, highlighting their latest Ultra Durable 3 technology on their latest lineup of motherboards. GIGABYTE once again leads the motherboard industry for the highest quality, most innovative motherboard design with their latest Ultra Durable 3 technology featuring double the amount of copper for the Power and Ground layers of the PCB. Most traditional motherboard designs utilize a single ounce of copper for each layer, whereas GIGABYTE's ultra Durable 3 motherboards feature 2 ounces per layer.

To start things off, on display will be live demos of GIGABYTE's flagship X58 motherboard, the GA-EX58-EXTREME as well as the GA-EX58-UD4P, both designed from the ground up to unleash the awesome power of Intel's new Core i7 processors and equipped with a host of new features including the new QPI interface, 3 channel DDR3 support, 3 Way SLI and CrossFireX support, Ultra Durable 3 technology and the industry's most extensive range of overclocking features. The GIGABYTE GA-EX58-EXTREME motherboard features the revolutionary new GIGABYTE Hybrid Silent-Pipe 2, a fusion thermal solution that combines GIGABYTE's proprietary screen cooling technology, external heat sink and liquid cooling with chipset water block to deliver maximum thermal performance.

Also on showcase will be the otherline GIGABYTE products at CeBIT 2009 .